NB INSTRUMENT
nanoCOAT C3+
Integrated coating, developing, heating and cleaning processes for wafers and substrates of many sizes.
More than a single coating step.
ON NANO describes C3+ as an integrated process approach combining Cover Chuck Coating, thermal processing, hydraulic dispensing and large-glass-panel development.
Its equipment family addresses research and manufacturing workflows for wafers, organic panels and large glass substrates, with manually loaded and automated configurations.
Coating is only the beginning.
Cover Chuck Coating
Controlled coating for uniform layer distribution and improved edge handling.
Thermal processing
Integrated heating processes within the wider substrate workflow.
Hydraulic dispensing
Precise material delivery as part of the C3+ process approach.
Developing
Process options for wafers and large glass panels.
Cleaning & etching
Complementary substrate preparation and finishing equipment.
Flexible deployment
Research, semi-automated and fully automated environments described by ON NANO.
One process chain, different scales.
ON NANO presents C3+ for coating, developing, heating, cleaning and etching across a wide substrate range. Its public product information describes demonstrations on wafers, organic panels and glass panels up to 1.1 × 1.1 m.
Configurations and process results depend on substrate, chemistry and selected modules.
For complex substrate workflows.
- Semiconductor process development
- Glass panel processing
- Sensors and advanced packaging
- Organic and transparent substrates
- Research and pilot manufacturing
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